ACID COPPER

HP SAPPHIRE ELITE 

(DYE-FREE Copper)

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• An ultra-high performance, dye free bright acid copper plating on metal or plastic substrates.

• Low stressed deposits.

• Excellent brightness and leveling across all current density ranges allowing for faster plating rates.

• One component system suited for automatic amphour feeders.

• Ideal for heavy copper builds requiring subsequent copper buff.

HP TOPAZ

(DYE-SYSTEM)

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• Ultra-high leveling, dye-containing brightener system for bright acid copper plating on metal or plastic.

• High Leveling and ductility, low stress deposit.

• Excellent brightness and leveling across all current density ranges.

• One component system suited for automatic amphour feeders.

• Ideal for copper builds requiring subsequent copper buff.

• Fully consumed by electrolysis (providing consistent results.) It is also less sensitive to higher temperatures, both of which minimize the need for frequent carbon purifications.

CYANIDE COPPER

HAVAPLATE CNCU   

(BRIGHT CYANIDE)

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• High speed cyanide copper plating process designed for plating bright, fine-grained and uniform deposits over a wide range of current densities.

• Ideal copper over zinc die-castings.

• Excellent buffing properties.

• Can be used in barrel and rack operations.

• Applied via direct current, interrupted current, or periodic reverse.

COPPER STRIKE

HP COBRE STRIKE 

(NON CYANIDE STRIKE)

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• CYANIDE FREE pyrophosphate-based copper plating system.

• Produces low-stressed and ductile copper deposits.

• Excellent throwing power and adhesion.

• Strikes on steel, zinc, zincated aluminum, and plastic.

• Suitable for rack and barrel operations.

• Complies with RoHS/WEEE

• Addition agents are dosed on an ampere-hour basis.